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Fan-Out Wafer-Level Packaging
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
1 450,00 DH
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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
| ISBN / EAN | 9789811088834 |
|---|---|
| Auteur | Lau, John H. |
| Editeur | Springer Verlag, Singapore |