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Hybrid Assemblies and Multichip Modules
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
2 620,00 DH
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| ISBN / EAN | 9780824784669 |
|---|---|
| Auteur | Kear |
| Editeur | Taylor & Francis Inc |