Hybrid Assemblies and Multichip Modules

Auteur: Kear
Editeur: Taylor & Francis Inc
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
Sur commande
ISBN / EAN 9780824784669
Auteur Kear
Editeur Taylor & Francis Inc