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Wafer-Level Chip-Scale Packaging
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
1 190,00 DH
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
| ISBN / EAN | 9781493954384 |
|---|---|
| Auteur | Qu, Shichun |
| Editeur | Springer-Verlag New York Inc. |